According to a leaked retail box for the Vivo X Fold 6, it will have a significant price increase over its predecessor.
Vivo is now gearing up for the launch of its next book-style foldable in China this Friday. The brand has recently started teasing the phone, revealing details such as its design and colorways. While it also shared some highlights, it remains mum on the model’s pricing.
Nonetheless, the phone’s retail box has surfaced online ahead of its announcement. The leak shows that it is available in four configurations (12GB/256GB, 12GB/512GB, 16GB/512GB, and 16GB/1TB). The main highlight of the leak, though, is the phone’s price tags, with its base price coming at CNY 9,999 ($1,475). To recall, the X Fold 5 arrived in the same configuration for only CNY 6,999 ($1,035). In this case, it means the brand plans to raise the model’s price by about 40%.
According to the leak, the other configurations are priced at CNY 10,999 ($1,625), CNY 11,499 ($1,700), and CNY 12,499 ($1,845), respectively.
Needless to say, the move might be the ongoing effect of the global memory crisis in the industry, prompting companies to adjust the prices of their offerings.
According to reports, the phone boasts a 200MP 1/1.4″ (f/1.68) Samsung HPB main camera with CIPA 4.5 and a Sony LYT-602 ZEISS APO periscope telephoto camera. Other details of the phone include a MediaTek Dimensity 9500 Super Edition processor, a Vivo V3+ imaging chip, and a 6900mAh battery. It is also reportedly coming with an 8.02″ Samsung M14 foldable internal display, while its front boasts a 6.51″ cover display. Both support 5000nits peak brightness and 1nit low-brightness mode. There will be two 20MP selfie cameras, one external and one internal. Its main camera system will allegedly include a 200MP primary sensor, a 50MP ultrawide, and a 50MP periscope telephoto. Ultimately, there will be full water resistance.
Vivo also confirmed that the Vivo X Fold 6 would be offered in Blue Hole, Salt Lake, Midnight, and Black Gold. It also supports the ZEISS Teleconverter G2 attachment, Parallel Mode, Atomic Workbench, and more.
