According to a new leak, Xiaomi is preparing a foldable smartphone powered by the brand’s upcoming in-house Xring O3 SoC.
That’s according to a recent discovery in the Mi code, which shows a device with the “Lhasa” codename and the 2608BPX34C model number. There are also references in the code, suggesting that it will be powered by the Xiaomi Xring O3 chipset.
The report says that the device could be the Xiaomi 17 Fold (or Xiaomi MIX Fold 5). Yet, it is important to note that a much earlier leak claimed that the model number belonged to the Xiaomi Mix Trifold.
