New specs of the upcoming Honor Magic 8 series leaked online. Some of the interesting details tipped include the series’ protection ratings, chip, and more.
The series is launching on October 15. The brand revealed its design earlier and even shared some of the Pro variant’s sample photos. Now, a series of leaks has divulged some of the lineup’s information that the company still hasn’t confirmed.
Interestingly, some of the new details are different from the ones we heard days ago. For instance, the tips mention a new telephoto resolution for the series and say that there won’t be a red maple sensor.
The leaks also include new details about the Honor Magic 8 and Honor Magic 8 Pro, such as their alleged IP68, IP69, and IP69K ratings. Based on these tips and the recent ones we heard, these are the specs of the two models:
Honor Magic 8
- 205g weight
- 7.95mm thickness
- Snapdragon 8 Elite Gen 5
- 1TB max storage
- 6.58″ flat 1.5K 120Hz LTPO OLED with 4320Hz PWM, LIPO technology and less than 1mm bezels, and 3D ultrasonic fingerprint sensor
- 50MP f/1.9 1/1.56″ main camera + 50MP f/2.0 ultrawide + 64MP f/2.5 periscope telephoto with 3x optical zoom
- 50MP selfie camera
- 7000mAh battery
- 90W charging
- Mtela frame
- Glass back panel
- Camera button
- Dual speakers
- Beidou satellite messaging
- Android 16
- IP68, IP69, and IP69K ratings
- Black, White, Gold, and Blue
Honor Magic 8 Pro
- 222g
- Snapdragon 8 Elite Gen 5
- 16GB/1TB configuration (other options expected)
- 6.71″ micro-quad curved display 1.5k with 3D face recognition and a 3D ultrasonic fingerprint scanner support
- 50MP 23mm f/1.6 1/1.3″ OmniVision OV50Q main camera + 50MP ultrawide + 200MP 1/1.4″ 85mm periscope telephoto
- 7200mAh battery
- 120W wired and 80W wireless charging
- AI button
- Android 16
- MagicOS 10
- Rising Sun Gold Sand, Azure, Snow White, and Velvet Black
