Xiaomi has finally confirmed that its next foldable will be named the Xiaomi 18 Fold.
The news has shut down earlier rumors that the device would instead be named the Xiaomi Mix Fold 5. Its moniker, nonetheless, is not its only highlight.
According to the Chinese giant, the device will be the first to use its next in-house Xring O3 chip, which will replace the Xring O1.
To recall, the SoC already impressed the tech world, since it was the company’s first major in-house flagship smartphone processor.
Now, it seems Xiaomi is pushing it further by giving the Xring O3 more power.
As per the brand, the said processor recorded 5,228,014 points AnTuTu V11, surpassing the performances of all phone chips available today.
On Geekbench 6.5, it scored 3,945 and 15,221 in the single-core and multi-core tests, respectively. While the Apple A19 Pro outperformed it in the former, the Xring O3 significantly overshadowed the Cupertino brand’s chip in the multi-core test.
Xiaomi also claims that the chip outperforms its predecessor in the Aztec Ruins 1440P, Steel Nomad Light, and Solar Bay Extreme benchmark tests by 94%, 85%, and 182%, respectively.
Xiaomi says the 3nm Xring O3 features a 10-core CPU. This includes two 4.35GHz C1-Ultra cores, four 3.68GHz C1-Premium cores, and four 3.15GHz C1-Pro cores.
If the claims about its performance are true, the Xring O3 will be a tough competitor, challenging the current SoC giants like Qualcomm and MediaTek. Yet, we still have to wait for the phone to see its actual performance.
Stay tuned!
