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Upcoming MediaTek Dimensity 8100 specifications revealed!

MediaTek will be soon announcing its MediaTek Dimensity 8100 chipset, it will be the toned-down version of the flagship Dimensity 9000 chipset. The same chipset is expected to power up the upcoming “Rubens” (Redmi K50/ Redmi K50 Pro) device, However, there is no official confirmation on the chipset yet. The specifications of the Dimensity 8100 has been revealed online now.

MediaTek Dimensity 8100 chipset

Known tipster Digital Chat Station on the Chinese Microblogging Platform, Weibo, has revealed the specifications of the upcoming MediaTek Dimensity 8100 chipset. According to him, the chipset will be based on an octa-core CPU with 4X Cortex A78 performance cores clocked at 2.85Ghz and 4X Cortex A55 power-saving cores clocked at 2.0Ghz. The graphic intensive and gaming related tasks will be handled by the Mali G610 MC6 CPU. The frequency of GPU is still unknown. The chipset will have an L3 cache of 4MB. The chipset will be built on TSMC’s 5nm fabrication process.

As mentioned earlier, Redmi will be one of the first brands to introduce the following chipset in their smartphone. To give you an idea about its performance, the Dimensity 9000 is powered by 1X Cortex X2 clocked at 3.2Ghz, 3X Arm Cortex-A710 clocked at 2.85GHz, 4X Arm Cortex-A510 clocked at 1.8Ghz and it also has Mali G710 MP10 GPU. The specifications on the Dimensity 9000 is slightly more powerful as compared to Dimensity 8100. The MediaTek Dimensity is likely to compete with the Qualcomm Snapdragon 888 chipset.

Apart from this, we don’t have much information about the chipset. An official announcement from MediaTek will throw light on the specifications of the chipset. The official launch of the chipset might happen in the upcoming months or anytime soon.

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